N Varalaxmi
Due to the latest development in recent technology, researchers and industrialist attention is towards the developing of new ferrite materials. Multilayered
substrate and ceramic packaging process technology has a worldwide importance due to increasing demand for miniaturization of electronic circuits and
higher performances devices led to. This intense demand for high performance and miniaturization of many electronic devices, which exclusively needs
soft magnetic materials with high permeability and high resistivity. To satisfy these demands few ferrites materials are best suited for these applications.
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